Samsung recently began sampling of its 32 Gb capacity DDR4 memory chips. The new products will simplify production of high-capacity memory modules that use multiple DRAM packages.

Samsung’s 32 Gb A-die DDR4-2666 chips are comprised of two stacked 16 Gb DDR4 dies produced using the company’s 10 nm-class process technology. Samsung offers two versions of 32 Gb DDR4 packages: one featuring a 2G x8 organization, another featuring a 1G x16 organization. The former is seen by memory controller as two memory devices, whereas the latter is considered as one DRAM device. The DDPs (dual die packages) come in standard 78 or 96-ball FBGA form-factor and use the industry-standard voltage of 1.2 V.

JEDEC’s DDR4 specification only describes 4 Gb, 8Gb, and 16 Gb memory devices. As a result, DRAM makers have to use advanced packaging techniques to build chips for high-capacity memory modules for servers or workstations. DDPs are not something particularly new, but 32 Gb DDR4-2666 DDPs are unique to Samsung.

32 Gb DDR4 memory chips will enable makers of modules and PCs to use fewer DRAM chips for building high-capacity solutions for applications that require high memory density or small form-factors. Obviously, dual-rank memory modules will still require support from memory controllers, but at least it will be easier to build high-capacity memory sub-systems using these chips.

Samsung does not disclose pricing of its 32 Gb DDR4-2666 DDPs, but it is obvious that they will be sold at a premium given the fact that they are only available from Samsung and they are harder to build than SDPs.

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Source: Samsung
Note: Images of DRAM modules are for illustrative purposes only.

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  • HStewart - Wednesday, May 15, 2019 - link

    My Dell XPS 15 2in1 was suppose to have an option for 32G of memory, maybe this is what Dell was waiting for - Dell indicated that 32G option was not going to be available until early 2019, maybe this product is late.
  • Jedi2155 - Wednesday, May 15, 2019 - link

    What makes this different than this module that showed up almost 4 years ago?

    Both mention the use of a 32 Gb DDR4 memory chip.
  • schujj07 - Wednesday, May 15, 2019 - link

    That is a LRDIMM and I think these are going to be able to be used in UDIMMs.
  • Casper42 - Thursday, May 16, 2019 - link

    UDIMMs? I doubt it.
    Maybe RDIMMs though.
  • yuhong - Saturday, May 18, 2019 - link

    DDP RDIMMs are not allowed either, it must be LRDIMM.
  • MadAd - Wednesday, May 15, 2019 - link

    Awesome, one step closer to SFF becoming mainstream.
  • JoeyJoJo123 - Wednesday, May 15, 2019 - link

    Biggest hurdle for SFF is the price premium paid for smaller components such as chassis, power supply, mini-itx (or smaller) boards, etc. The upper ceiling on hardware limitations hasn't really been an issue becuase you could already get ridiculous setups if you had the money, whereas money couldn't always solve the noise vs temperature issue with compact cooling solutions. So people who are into SFF just get modestly good parts, with an emphasis on power efficiency/cooling.

    For example, you could get an LGA 2099 socket mini-ITX system using AsRock's X299E-ITX but hardly anyone ever does (instead opting for the mainstream Z-series overclockable boards or AMD 400 series with Ryzen chips), just because cooling such a hot processor inside a small chassis with a compact cooling solution becomes a problem.

    I don't think people were like "man, I want a SFF, but without getting 64GB of ram with my 2 DIMM slot limitation... I think I'll have to pass". It's moreso "I want a SFF, but these things are too hard to build in and too expensive relative to a regular tower PC with similar specs"
  • Skeptical123 - Wednesday, May 15, 2019 - link

    This ram would be useful to use when you need more ram but your motherboard has say only two slots. Assuming the cpu can support it. Does anyone know if would there be performance would be hit?

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