3nm

Synopsys has introduced the industry's first full-stack AI-powered suite of electronic design automation tools that covers all stages of chip design, from architecture to design and implementation to manufacturing. The Synopsys.ai suite promises to radically reduce development time, lower costs, improve yields, and enhance performance. The set of tools is set to be extremely useful for chips set to be made on leading-edge nodes, such as 5nm, 3nm, 2nm-class, and beyond. Chip Design Challenges As chips gain complexity and adopt newer process technologies, their design and manufacturing costs escalate to unprecedented levels. Designing a reasonably complex 7 nm chip costs about $300 million (including ~ 40% for software). In contrast, the design cost of an advanced 5 nm processor exceeds $540 million (including software), according to...

Samsung Starts Mass Production at V1: A Dedicated EUV Fab for 7nm, 6nm, 5nm, 4nm, 3nm Nodes

Samsung Foundry has started mass production of chips using its 6LPP and 7LPP manufacturing processes at its new V1 fab. The new facility employs one of the industry’s first...

30 by Anton Shilov on 2/20/2020

Intel’s Manufacturing Roadmap from 2019 to 2029: Back Porting, 7nm, 5nm, 3nm, 2nm, and 1.4 nm

One of the interesting disclosures here at the IEEE International Electron Devices Meeting (IEDM) has been around new and upcoming process node technologies. Almost every session so far this...

138 by Dr. Ian Cutress on 12/11/2019

TSMC: 3nm EUV Development Progress Going Well, Early Customers Engaged

Development of new fabrication technologies never stops at leading-edge companies such as TSMC. Therefore, it is not surprising to hear the annoucement that development of TSMC’s 3nm node is...

76 by Anton Shilov on 7/23/2019

Synopsys to Accelerate Samsung’s 7nm Ramp with Yield Explorer Platform

Synopsys has announced an acceleration of development on its yield learning platform designed to speed up ramp up of chips made using Samsung Foundry’s 7LPP (7 nm low power...

16 by Anton Shilov on 7/4/2019

Samsung Announces 3nm GAA MBCFET PDK, Version 0.1

So what comes after 7nm, after 6nm, after 5nm, and after 4nm? That's right: 3nm! At Samsung's Foundry Forum event today, Samsung has announced that the first alpha version...

32 by Dr. Ian Cutress on 5/14/2019

Samsung Foundry Updates: 8LPU Added, EUVL on Track for HVM in 2019

Samsung recently hosted its Samsung Foundry Forum 2018 in Japan, where it made several significant foundry announcements. Besides reiterating plans to start high-volume manufacturing (HVM) using extreme ultraviolet lithography...

29 by Anton Shilov on 9/6/2018

GlobalFoundries Gives 7 nm Capacity Update, Mulls Skipping 5 nm

High-ranking executives of GlobalFoundries this month gave several updates concerning future plans of the contract maker of semiconductors. As it appears, in a bid to provide more tangible advantages...

19 by Anton Shilov on 5/31/2018

Samsung Foundry Roadmap: EUV-Based 7LPP for 2018, 3 nm Incoming

Samsung Foundry this week updated its fabrication technology roadmap, introducing a number of changes and announcing the first details about its 3 nm manufacturing process that is several years...

25 by Anton Shilov on 5/24/2018

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